Display device

ABSTRACT

A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of Korean PatentApplications Nos. 10-2016-0155982, filed on Nov. 22, 2016 in the KoreanIntellectual Property Office, and 10-2016-0162159, filed on Nov. 30,2016 in the Korean Intellectual Property Office, the entire content ofeach of which is hereby incorporated by reference.

BACKGROUND 1. Field

Aspects of embodiments of the present disclosure relate to a displaydevice and, more particularly, to a display device having improvedreliability.

2. Description of the Related Art

A display device displays an image in response to electrical signals toprovide a user with information. The display device includes variouscomponents, such as a display panel, a driving circuit, etc., to processelectrical signals used to drive the display device. The componentsgenerate heat while being activated in response to the electricalsignals. The display device includes a heat radiating member todischarge the heat. The heat radiating member prevents other componentsfrom being damaged due to the heat generated from the components.

SUMMARY

According to an aspect of the present disclosure, a display device iscapable of preventing or substantially preventing layers from beingdelaminated due to deterioration of adhesive force and improvingreliability in coupling of a heat radiating member.

According to one or more embodiments, a display device includes adisplay panel to display an image, a heat radiating member at a sideportion of the display panel and including a first adhesive layer, asecond adhesive layer, and a heat radiating layer between the firstadhesive layer and the second adhesive layer, and a heat generatingmember overlapping with the display panel and the heat radiating memberwhen viewed in a plan view. The heat radiating member includes a firstarea overlapping the heat generating member and a second area adjacentto the first area when viewed in a plan view, the first adhesive layerand the second adhesive layer are connected to each other through aplurality of through holes defined through the heat radiating layer, andthe plurality of through holes includes a through hole in at least thesecond area.

The heat generating member may include a driving device mounted on thedisplay panel to apply an electrical signal to the display panel.

The heat generating member may include a circuit board including asubstrate connected to the display panel and a driving device mounted onthe substrate to apply an electrical signal to the display panel, andthe heat radiating member may be arranged between the circuit board andthe display panel.

The heat generating member may include a power supply member arrangedunder the heat radiating member to supply a power to the display panel.

Each of the through holes may have a circular shape, an oval shape, apolygonal shape, a closed loop shape, or combination thereof when viewedin a plan view.

Each of the through holes may have a diameter equal to or greater thanabout 2.4 mm, the diameter corresponding to a diameter of acircumscribed circle of the through hole.

A distance between two adjacent through holes among the plurality ofthrough holes may be equal to or greater than about 4 mm.

The through holes may include a first through hole arranged in the firstarea and a second through hole arranged in the second area.

The first through hole may have a cross-sectional area equal to orsmaller than a cross-sectional area of the second through hole.

Each of the first through hole and the second through hole may beprovided in a plural number, and a ratio of the first through holes tothe first area may be smaller than a ratio of the second through holesto the second area.

The through holes may be arranged along an edge of the heat radiatinglayer.

At least one of the first adhesive layer and the second adhesive layermay include a double-sided adhesive tape.

The heat radiating member may further include a metal layer on a surfaceof at least one of the first adhesive layer and the second adhesivelayer.

The metal layer may include copper.

The heat radiating member may further include an insulating layer on asurface of at least one of the first adhesive layer and the secondadhesive layer.

The insulating layer may include at least one of polyimide andpolyethylene terephthalate.

The display device may further include a third adhesive layer betweenthe second adhesive layer and the heat radiating layer, the thirdadhesive layer may be penetrated by the through holes, and the secondadhesive layer may be connected to the first adhesive layer through thethrough holes.

The display device may further include a frame member surrounding anedge of the heat radiating member, and the display panel may entirelycover the heat radiating member and the frame member.

The frame member may be spaced apart from an outer line of the heatradiating member when viewed in a cross section.

The display device may further include a shock relief member disposedbetween the display panel and the heat radiating member, and the shockrelief member may entirely cover the heat radiating member and the framemember when viewed in a plan view.

The second adhesive layer may further include a plurality of concaveportions respectively overlapping the through holes.

Some of the through holes may include a space surrounded by the firstadhesive layer, the second adhesive layer, and the heat radiating layer.

According to the above, the adhesive characteristics between the heatradiating member and components disposed adjacent to the heat radiatingmember is enhanced, and thus the display device may have improvedcoupling reliability. In addition, the heat radiating member of thedisplay device may concurrently or simultaneously have the heatdischarging characteristics and the adhesive characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

The patent or application file contains at least one drawing executed incolor. Copies of this patent or patent application publication withcolor drawing(s) will be provided by the Office upon request and paymentof the necessary fee.

The above and other aspects of the present disclosure will becomereadily apparent by reference to the following description whenconsidered in conjunction with the accompanying drawings, wherein:

FIG. 1A is an exploded perspective view showing a display deviceaccording to an exemplary embodiment of the present disclosure;

FIG. 1B is a cross-sectional view showing a portion of the displaydevice shown in FIG. 1A;

FIGS. 2A to 2C are cross-sectional views showing portions of a displaydevice according to an exemplary embodiment of the present disclosure;

FIGS. 3A to 3D are plan views showing heat radiating members of adisplay device, according to some exemplary embodiments of the presentdisclosure;

FIG. 4A is a view showing a temperature distribution of a comparisonexample;

FIG. 4B is a view showing a temperature distribution of a display deviceaccording to an exemplary embodiment of the present disclosure;

FIG. 5A is a plan view showing a heat radiating member of a displaymember, according to an exemplary embodiment of the present disclosure;

FIG. 5B is a plan view showing a portion of the heat radiating membershown in FIG. 5A;

FIG. 5C is a plan view showing a heat radiating member according toanother exemplary embodiment of the present disclosure;

FIG. 5D is a plan view showing a portion of the heat radiating membershown in FIG. 5C;

FIGS. 6A to 6C are views showing temperature distributions of displaydevices according to exemplary embodiments of the present disclosure;

FIG. 7A is an exploded perspective view showing a display deviceaccording to another exemplary embodiment of the present disclosure;

FIG. 7B is a cross-sectional view showing a portion of the displaydevice shown in FIG. 7A;

FIGS. 8A to 8C are plan views showing heat radiating members of adisplay device, according to some exemplary embodiments of the presentdisclosure;

FIG. 9A is an exploded perspective view showing a display deviceaccording to another exemplary embodiment of the present disclosure;

FIG. 9B is a perspective view showing the display device of FIG. 9A inan assembled state;

FIG. 9C is a cross-sectional view showing a portion of the displaydevice shown in FIG. 9B;

FIGS. 10A to 10C are plan views showing heat radiating members of adisplay device, according to some exemplary embodiments of the presentdisclosure;

FIG. 11A is an exploded perspective view showing a display deviceaccording to another exemplary embodiment of the present disclosure;

FIG. 11B is a cross-sectional view showing a portion of the displaydevice shown in FIG. 11A;

FIG. 12A is a cross-sectional view showing a portion of a display deviceaccording to another exemplary embodiment of the present disclosure;

FIG. 12B is a cross-sectional view showing a portion of a display deviceaccording to another exemplary embodiment of the present disclosure; and

FIG. 12C is a cross-sectional view showing a portion of a display deviceaccording to another exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION

Herein, some embodiments of the present invention will be explained infurther detail with reference to the accompanying drawings.

FIG. 1A is an exploded perspective view showing a display device DMaccording to an exemplary embodiment of the present disclosure; and FIG.1B is a cross-sectional view showing a portion of the display device DMshown in FIG. 1A. For the convenience of explanation, FIG. 1B shows thecross-sectional view taken along lines I-I′ and II-II′ shown in FIG. 1A.Herein, the display device DM will be described in further detail withreference to FIGS. 1A and 1B.

The display device DM includes a display panel 100, a heat radiatingmember 200, and a heat generating member 300. In the present exemplaryembodiment, the heat generating member 300 is positioned in the displaypanel 100.

The display panel 100 displays an image in response to electricalsignals. The display panel 100 is activated by the electrical signals.Accordingly, the display panel 100 may be one of heat generating membersgenerating heat while being activated.

The display panel 100 includes a display area DA and a peripheral areaPA on a plane surface defined by a first direction DR1 and a seconddirection DR2.

The display area DA may include a plurality of pixels arranged therein.Accordingly, the image is displayed through the display area DA. A userreceives information from the image displayed through the display areaDA.

The peripheral area PA is disposed adjacent to the display area DA. Inthe present exemplary embodiment, the peripheral area PA has a shapesurrounding an edge of the display area DA. However, the peripheral areaPA may be disposed adjacent to a portion of the edge of the display areaDA according to another embodiment.

Although not shown in the figures, the display panel 100 may furtherinclude a touch sensor to sense a touch event applied thereto from theoutside of the display panel 100 or a pressure sensor to sense apressure applied thereto from the outside of the display panel 100.

The heat radiating member 200 may be disposed on a side portion of thedisplay panel 200. The heat radiating member 200 may be disposed on theside portion opposite to a side portion in which the image is displayedof the display panel 100. In the present exemplary embodiment, the heatradiating member 200 is disposed on a lower portion of the display panel100.

The heat radiating member 200 discharges the heat generated from heatgenerating members disposed adjacent thereto. Accordingly, the heatgenerated from the heat generating members disposed adjacent to the heatradiating member 200 may be easily discharged through the heat radiatingmember 200, and thus the heat generating members may be stably operatedafter a drive time (e.g., a predetermined drive time) elapses. The heatradiating member 200 may include a heat radiating layer 210, a firstadhesive layer 220, a second adhesive layer 230, and an outer layer 240.The heat radiating layer 210 may be disposed between the first adhesivelayer 220 and the second adhesive layer 230.

The heat radiating layer 210 may include a material having high heatconductivity. As the heat conductivity of the heat radiating layer 210becomes high, heat discharging characteristics of the heat radiatingmember 200 may be improved. For instance, the heat radiating layer 210may include an organic material having high heat conductivity, e.g.,graphite, or a metal material.

The heat radiating layer 210 may include a plurality of through holes THdefined therethrough. The through holes TH penetrate through the heatradiating layer 210. The through holes TH may be arranged in a varietyof shapes when viewed in a plan view. The arrangement of the throughholes TH will be described in further detail later herein.

The first adhesive layer 220 is disposed on a surface of the heatradiating layer 210. The first adhesive layer 220 may be disposedbetween the heat radiating layer 210 and the display panel 100. Thefirst adhesive layer 220 may make contact with the surface of the heatradiating layer 210.

The heat radiating member 200 may be attached to a member disposedthereon by the first adhesive layer 220. In the present exemplaryembodiment, the first adhesive layer 220 may directly make contact withthe display panel 100.

The second adhesive layer 230 is disposed on the other surface of theheat radiating layer 210. The second adhesive layer 230 may be disposedbetween the heat radiating layer 210 and the outer layer 240. The secondadhesive layer 230 may make contact with the other surface of the heatradiating layer 210.

In the present exemplary embodiment, portions of the first adhesivelayer 220 may protrude into the through holes TH, respectively. Portionsof the second adhesive layer 230 may protrude into the through holes TH,respectively. The protruded portions of the first adhesive layer 220 maymake contact with the protruded portions of the second adhesive layer230 in contact areas CA, respectively.

The contact areas CA overlap the through holes TH when viewed in a planview. Since each of the first adhesive layer 220 and the second adhesivelayer 230 has an adhesive force, the first adhesive layer 220 and thesecond adhesive layer 230 may be attached to each other in the contactareas CA.

The contact areas CA may be defined in the through holes TH,respectively. Accordingly, the first adhesive layer 220 and the secondadhesive layer 230 may be connected to each other through the throughholes TH.

Thus, a same effect may be obtained in the areas through which thethrough holes TH are defined as that obtained by means of arranging aplurality of adhesive members. Since the heat radiating member 200according to the present exemplary embodiment further includes thethrough holes TH, the adhesive force may be improved without adding theadhesive member.

For the convenience of explanation, Table 1 shows a release force of theheat radiating member 200 according to the present exemplary embodimentand a release force of a comparison example.

TABLE 1 Release force (gF/25 mm) #1 #2 #3 #4 #5 Average Comparison 41.448.1 43 45.7 46.5 44.94 example (CC) Embodiment 74.7 72.2 82.5 78.6 79.477.48 example (EX)

Table 1 shows result values obtained by performing experiments on fivesamples each in which the comparison example CC is attached to an objectand on five samples each in which the embodiment example EX is attachedto an object. All components and conditions of the experiments are thesame except for the through holes TH.

Referring to Table 1, the average value of the release force of theembodiment example EX of the present disclosure is about 1.7 timesgreater than the average value of the release force of the comparisonexample CC. Accordingly, the heat radiating member 200 according to theexemplary embodiment of the present disclosure may have improvedadhesive characteristics by defining the through holes TH through theheat radiating member 200.

The outer layer 240 is disposed under and attached to the secondadhesive layer 230. The outer layer 240 prevents the second adhesivelayer 230 from making contact with an outside environment and protectsthe heat radiating layer 210. However, in an embodiment, the outer layer240 may be omitted from the heat radiating member 200.

In an embodiment, for example, the outer layer 240 may be a releasefilm. Accordingly, the outer layer 240 may prevent or substantiallyprevent a deterioration of adhesive characteristics of the secondadhesive layer 230, which may be caused by an external contaminantduring a process. Then, the outer layer 240 may be removed from thesecond adhesive layer 230, and the second adhesive layer 230 may attachan external member separately provided to the heat radiating member 200.

As another example, the outer layer 240 may be a protective member.Accordingly, the outer layer 240 may include a material having rigidity(e.g., a predetermined rigidity). The outer layer 240 may protect theheat radiating layer 210, and the separately provided external membermay be attached to the outer layer 240 by an adhesive layer separatelyprovided.

The heat generating member 300 may be a driving circuit mounted on thedisplay panel 100. The driving circuit 300 applies electrical signals tothe display panel 100 or processes electrical signals from the displaypanel 100. The driving circuit 300 may be provided in an integrated chipform or in a structure configured to include a conductive layer and aninsulating layer.

The driving circuit 300 may include a plurality of driving devices and aplurality of signal lines connecting the driving devices to each otheror the driving devices to the pixels of the display panel 100.Accordingly, the driving circuit 300 may be one of heat generatingmembers that generate heat while operating.

In the present exemplary embodiment, the heat radiating member 200 maybe divided into a first area AR1 and a second area AR2 when viewed in aplan view. The first area AR1 may be an area of the heat radiatingmember 200 which overlaps the heat generating member 300. The heatradiating member 200 may be adjacent to the display panel 100 and theheat generating member 300 in the first area AR1 when viewed in athickness direction DR3 (herein, referred to as a “third direction”).

The second area AR2 is disposed adjacent to the first area AR1. Thesecond area AR2 may not overlap the heat generating member 300 whenviewed in a plan view. The heat radiating member 200 may be disposedadjacent to the display panel 100 in the second area AR2. Thus, the heatgenerated from the first area AR1 may be higher than that generated fromthe second area AR2.

The through holes TH may be arranged in at least the second area AR2. Inthe present exemplary embodiment, the through holes TH may be arrangedin the second area AR2 and not overlap the first area AR1.

Since the through holes TH are defined through the heat radiating layer210, the through holes TH may be mainly arranged in an area adjacent tothe heat generating member that generates a relatively low heat.Accordingly, the adhesive characteristics of the heat radiating member200, which is improved by the through holes TH, may be prevented orsubstantially prevented from being deteriorated due to the heatgenerated from the display device DM. Thus, the heat radiating member200 may improve the heat discharging characteristics in a high heatgenerating area and improve the adhesive characteristics in a low heatgenerating area.

According to the display device DM according to the present exemplaryembodiment, the through holes TH are defined through the heat radiatingmember 200, and thus the adhesive characteristics of the heat radiatingmember 200 may be improved. In addition, since the arrangement of thethrough holes TH is differently determined depending on a heatgeneration degree, the heat discharging characteristics and the adhesivecharacteristics may be selectively controlled for each area.Accordingly, the heat discharging characteristics and the adhesivecharacteristics of the heat radiating member 200 may be substantiallyand simultaneously improved.

FIGS. 2A to 2C are cross-sectional views showing portions of a displaydevice according to an exemplary embodiment of the present disclosure.For the convenience of explanation, FIG. 2A shows the heat radiatingmember 200 temporarily attached to the display panel 100; and FIGS. 2Band 2C show the heat radiating member 200 completely attached to thedisplay panel 100. Hereinafter, the display device will be described infurther detail with reference to FIGS. 2A to 2C.

Referring to FIG. 2A, in the heat radiating member 200 temporarilyattached to the display panel 100, the first adhesive layer 220 may notmake contact with the second adhesive layer 230. The first adhesivelayer 220 may be spaced apart from the second adhesive layer 230 in thethird direction DR3 such that the through holes TH are positionedbetween the first and second adhesive layers 220 and 230. In this case,a coupling force acting between the display panel 100 and the heatradiating member 200 may correspond to an adhesive force of the firstadhesive layer 220.

Then, as shown in FIG. 2B, when a pressure (e.g., a predeterminedpressure) PS is applied to the first and second adhesive layers 220 and230 after the temporary attachment, at least portions of the first andsecond adhesive layers 220 and 230 may protrude into the through holesTH.

The shape of the first and second adhesive layers 220 and 230 havingflexibility may be deformed by the pressure PS applied thereto or a heatgenerated by the pressure PS, and thus the first and second adhesivelayers 220 and 230 may partially enter into the through holes TH. Theprotruded portions of the first adhesive layer 220 may make contact withthe protruded portions of the second adhesive layer 230, respectively.

The first and second adhesive layers 220 and 230 make contact with eachother to define the contact areas CA. A cross-sectional size of thecontact area CA may be equal to or smaller than a cross-sectional sizeof the through hole TH when viewed in a plan view.

Accordingly, the first and second adhesive layers 220 and 230 areconnected to each other through the through holes TH. In this case, thecoupling force acting between the display panel 100 and the heatradiating member 200 may correspond to the adhesive force between thefirst and second adhesive layers 220 and 230.

In an embodiment, as shown in FIG. 2C, at least one of a first adhesivelayer 220-1 and a second adhesive layer 230-1 may include a concaveportion RS defined therein. The concave portion RS may be defined in anarea corresponding to at least one of the through holes TH.

In an embodiment, the concave portion RS is defined in each of the firstand second adhesive layers 220-1 and 230-1, and the first and secondadhesive layers 220-1 and 230-1 may have a constant thickness throughoutand make contact with each other through the through holes TH.

In this case, a space (e.g., a predetermined space) SP may be definedbetween the display panel 100 and the first adhesive layer 220-1. Theadhesive area reduced by the space SP may be compensated by theimprovement of the adhesive force in an area adjacent to the space SP.

In an embodiment, at least one of the first adhesive layer 220 and thesecond adhesive layer 230 may be, but is not limited to, a double-sidedadhesive tape. Accordingly, an area not filled with the first and thesecond adhesive layers 220 and 230 may exist in the through holes TH.The area not filled with the first and the second adhesive layers 220and 230 may be surrounded by the first adhesive layer 220, the secondadhesive layer 230, and the heat radiating layer 210. However, thethrough holes TH may be fully filled with the first and second adhesivelayers 220 and 230 in accordance with the applied pressure PS and thethickness of at least one of the first and second adhesive layers 220and 230 according to other embodiments.

FIGS. 3A to 3D are plan views showing heat radiating members of adisplay device according to some exemplary embodiments of the presentdisclosure. For the convenience of explanation, FIGS. 3A to 3D show theheat generating member 300 (refer to FIG. 1A) disposed to overlap eachof heat radiating members 200-A, 200-B, 200-C, and 200-D as a dashedline. Herein, the heat radiating members 200-A, 200-B, 200-C, and 200-Dwill be described in further detail with reference to FIGS. 3A to 3D.

Referring to FIG. 3A, a plurality of through holes TH-A defined throughthe heat radiating member 200-A may include a first through hole TH1defined in the second area AR2 and a second through hole TH2 defined inthe first area AR1.

The first through hole TH1 is provided in a plural number and has acircular shape having a diameter (e.g., a predetermined diameter) DD.Each of the first through holes TH1 may have a cross-sectional areaincreasing as the diameter DD increases, and the adhesivecharacteristics of the heat radiating member 200-A may be improved.

Referring to FIGS. 3A to 3D, the first through holes TH1 may each havesame sizes as each other. However, according to another embodiment, thefirst through holes TH1 may have different sizes from each other. Inthis embodiment, each of the diameters DD may be different from eachother. The diameter DD may be designed in various ways and should not belimited to a specific embodiment.

One of the first through holes TH1 may have various sizes as long as theportion of the first adhesive layer 220 (refer to FIG. 1B) and theportion of the second adhesive layer 230 (refer to FIG. 1B) make contactwith each other in the one of the first through holes TH1. In anembodiment, for example, the diameter DD may be equal to or greater thanabout 2.4 mm.

As the diameter DD of each of the first through holes TH1 decreases, thearea of the heat radiating layer 210 (refer to FIG. 1B) increases andthe heat discharging characteristics of the heat radiating member 200-Amay be improved. Accordingly, a maximum value of the diameter DD of eachof the first through holes TH1 may indicate a size to secure a minimumarea of the heat radiating layer 210 that performs the desired heatdischarging function.

The first through holes TH1 are positioned spaced apart from the firstthrough holes TH1 adjacent thereto. For instance, the first throughholes TH1 are spaced apart from the first through holes TH1 adjacentthereto by a first pitch PT1 in the first direction DR1.

The first pitch PT1 may have any of various values. In an embodiment,for example, the first pitch PT1 may be equal to or smaller than about 4mm. As the first pitch PT1 increases, the heat discharging areaincreases. By contrast, as the first pitch PT1 decreases, the couplingforce of the heat radiating member 200 to be attached to othercomponents may be improved.

The first pitch PT1 may be defined in various direction. For instance,the first pitch PT1 may be defined in the second direction DR2, or in adirection oblique to the first direction DR1. The first pitch PT1 may beuniform in length or may be non-uniform (e.g., random) in length. Thefirst pitch PT1 may be designed in various ways and is not limited to aspecific embodiment.

The second through hole TH2 is positioned in the first area AR1. In anembodiment, the second through hole TH2 is provided in a plural number,and the second through holes TH2 are arranged in the first direction DR1at a second pitch PT2. In the present exemplary embodiment, the secondpitch PT2 is greater than the first pitch PT1. In addition, according tothe present exemplary embodiment, the second through holes TH2 arepositioned spaced apart from the first through holes TH1 in the seconddirection DR2, and the distance between one of the second through holesTH2 and one of the first through holes TH1 adjacent to each other in thesecond direction DR2 is smaller than the second pitch PT2.

However, according to another embodiment, the second pitch PT2 may bedesigned independent from the first pitch PT1. Accordingly, the secondpitch PT2 may be defined in any of various directions. For instance, thesecond pitch PT2 may be defined in the second direction DR2, or in adirection oblique to the first direction DR1. The second pitch PT2 maybe uniform in length or may be non-uniform (e.g., random) in length. Thesecond pitch PT2 may be designed in various ways and is not limited to aspecific embodiment.

In the present exemplary embodiment, each of the second through holesTH2 has the same diameter DD as that of each of the first through holesTH1, but the present disclosure is not limited thereto or thereby. Thatis, the diameters of the second through holes TH2 may be designedindependent from the first through holes TH1, may have various sizes,and are not limited to a specific embodiment.

In an embodiment, the number of the second through holes TH2 in thefirst area AR1 may be smaller than the number of the first through holesTH1 in the second area AR2. In an embodiment, a density of the secondthrough holes TH2 in the first area AR1 may be smaller than a density ofthe first through holes TH1 in the second area AR2.

As described above, the first area AR1 is relatively more greatlyinfluenced by the heat than the second area AR2. The number of thethrough holes, the density of the through holes, and the distribution ofthe through holes may exert influences on the adhesive characteristicsand the heat discharging characteristics. Accordingly, the number ordensity of the second through holes TH2 arranged in the first area AR1relatively more greatly influenced by the heat may be relatively smallerthan the number or density of the first through holes TH1 arranged inthe second area AR2.

Referring to FIG. 3B, a plurality of through holes TH-B defined throughthe heat radiating member 200-B may include a first through hole TH1 anda second through hole TH2-1. Each of the first through hole TH1 and thesecond through hole TH2-1 is provided in plural. The first through holesTH1 corresponds to the first through holes TH1 shown in FIG. 3A, andthus further detailed descriptions of the first through holes TH1 willbe omitted.

The first through holes TH1 and the second through holes TH2-1 may havedifferent diameters from each other. In an embodiment, each of thesecond through holes TH2-1 has a circular shape having a second diameterDD2. The second diameter DD2 may be greater than a first diameter DD1 ofone the first through holes TH1.

In an embodiment, the second through holes TH2-1 may be spaced apartfrom the second through holes TH2-1 adjacent thereto at the samedistance as the distance between the first through holes TH1 and thefirst through holes TH1 adjacent thereto. Accordingly, an arrangement inthe first direction DR1 of the second through holes TH2-1 may correspondto an arrangement in the first direction DR1 of the first through holesTH1.

In the heat radiating member 200-B according to the present exemplaryembodiment, each of the second through holes TH2-1 having the relativelysmall second diameter DD2 is positioned in the first area AR1 relativelymore greatly influenced by the heat, and thus the heat dischargingcharacteristics of the heat radiating member 200-B may be prevented orsubstantially prevented from being deteriorated and the adhesivecharacteristics of the heat radiating member 200-B may be improved.

Referring to FIG. 3C, a plurality of through holes TH-C of the heatradiating member 200-C may be uniformly arranged in the heat radiatingmember 200-C. A plurality of second through holes TH2 may be arrangedcorresponding to a plurality of first through holes TH1. A second pitchPT2 may substantially be the same as a pitch of the first through holesTH1. Therefore, the first through holes TH1 and the second through holesTH2 may be arranged in a matrix.

Referring to FIG. 3D, a plurality of through holes TH-D of the heatradiating member 200-D may be arranged along an edge (e.g., at allsides) of the heat radiating member 200-D. First and second throughholes TH1 and TH2 are arranged to form a frame shape when viewed in aplan view. Accordingly, the heat radiating member 200-D may haveimproved adhesive characteristics along the edge in which a possibilityof penetration of a foreign substance is relatively high and maymaintain the heat discharging characteristics in a center area in whichthe heat generation is relatively high.

The through holes may be defined through the heat radiating members200-A, 200-B, 200-C, and 200-D according to the embodiments in variousforms. The heat radiating members 200-A, 200-B, 200-C, and 200-D mayeasily control the heat discharging characteristics and the adhesivecharacteristics by controlling the arrangement or density of the throughholes.

FIG. 4A is a view showing a temperature distribution of a comparisonexample; and FIG. 4B is a view showing a temperature distribution of adisplay device according to an exemplary embodiment of the presentdisclosure.

FIG. 4A shows the temperature distribution of a display device includinga heat discharging member, through which the through hole TH (refer toFIG. 1A) is not defined, and a window member covering the display panel;and FIG. 4B shows the temperature distribution of the display deviceincluding the display panel, the heat radiating member 200 (refer toFIG. 1A), and the window member. The temperature distributions shown inFIGS. 4A and 4B are respectively obtained from the display deviceshaving the same structure except for the heat radiating member.

Meanwhile, FIGS. 4A and 4B show temperatures measured at an upper side(outside) of the window members. Temperatures measured at drivingcircuits respectively built in the display device of the comparisonexample and the display device DM are indicated by a peak in a righttemperature graph. Referring to FIGS. 4A and 4B, areas, in which thetemperature is highest, of the display device of the comparison exampleand the display device DM of the present disclosure may overlap with thearea in which the driving circuit 300 (refer to FIG. 1) is positioned.

As shown in FIG. 4A, the temperature of the driving circuit according tothe comparison example was measured at about 42.96 degrees. The highesttemperature measured in the comparison example was about 39.24 degrees,and a difference in temperature between two areas overlapping each otherwhen viewed in a plan view was measured at about 3.72 degrees.

The temperature of the driving circuit 300 according to the embodimentexample was measured at about 43.18 degrees. In this case, as shown inFIG. 4B, the highest temperature measured in the display device DM wasabout 39.50 degrees, and a difference in temperature between two areasoverlapping each other when viewed in a plan view was measured at about3.68 degrees.

That is, the display device DM according to the present disclosure has atemperature reduction effect relatively smaller than that of thecomparison example. However, the temperature reduction differencebetween the embodiment example and the comparison example is equal to orsmaller than about 1 degree.

In the display device DM according to the exemplary embodiment of thepresent disclosure, the area of the heat radiating layer may be reducedby the through holes TH defined through the heat radiating layer, butinfluences on the heat discharging characteristics by the reduction ofthe heat discharging area is practically negligible. On the contrary, asdescribed above, since the through holes TH are defined through the heatradiating member, the adhesive characteristics represented by therelease force were greatly improved. Accordingly, the display device DMincluding the heat radiating member through which the through holes THare defined may have the improved adhesive characteristics whileensuring the heat discharging characteristics.

FIG. 5A is a plan view showing a heat radiating member according toanother exemplary embodiment of the present disclosure; FIG. 5B is aplan view showing a portion of the heat radiating member shown in FIG.5A; FIG. 5C is a plan view showing a heat radiating member according toanother exemplary embodiment of the present disclosure; and FIG. 5D is aplan view showing a portion of the heat radiating member shown in FIG.5C. FIGS. 6A to 6C are views showing temperature distributions ofdisplay devices according to exemplary embodiments of the presentdisclosure.

For the convenience of explanation, a heat radiating member 300 isrepresented by a dashed line in FIGS. 5A and 5C. FIGS. 6A to 6C showtemperature distributions in display devices each including a displaypanel, a heat radiating member, and a window member. FIGS. 6A to 6Crespectively show temperature distributions measured at the windowmember.

In further detail, FIG. 6A shows the temperature distribution of adisplay device including the heat radiating member 200-C as shown inFIG. 3C; FIG. 6B shows the temperature distribution of a display deviceincluding a heat radiating member 200-S1 as shown in FIG. 5A; and FIG.6C shows the temperature distribution of a display device including aheat radiating member 200-S2 as shown in FIG. 5C. Herein, the heatradiating members 200-S1 and 200-S2 according to the present disclosurewill be described in further detail with reference to FIGS. 5A to 5D and6A to 6C.

In the present exemplary embodiments, a plurality of through holes mayhave a variety of shapes. For example, through holes TH-S1 each having atriangular shape may be defined through the heat radiating member200-S1, as shown in FIGS. 5A and 5B.

The through holes TH-S1 may be arranged spaced apart from each other ata pitch (e.g., a predetermined pitch) PT-A in a first direction DR1. Inan embodiment, the through holes TH-S1 are spaced apart from each otherat the same pitch PT-A in the first direction DR1.

The through holes TH-S1 include a plurality of first through holes TH1-Tarranged in a second area AR2 and a plurality of second through holesTH2-T arranged in a first area AR1. In an embodiment, the first throughholes TH1-T and the second through holes TH2-T may have the same shape,as a representative example. However, embodiments of the presentdisclosure are not limited thereto.

The first through hole TH1-T may have the triangular shape having threevertices making contact with a circumscribed circle (e.g., apredetermined circumscribed circle) CC-T. In the present exemplaryembodiment, a center T-0 of the circumscribed circle CC-T may correspondto a center of the first through hole TH1-T. Accordingly, the pitch PT-Acorresponds to a distance in the first direction DR1 between the centerT-0 of the circumscribed circle CC-T and a center of a circumscribedcircle around another first through hole TH1-T adjacent to thecircumscribed circle CC-T. In an embodiment, a diameter DD-T of thefirst through hole TH1-T may correspond to a diameter of thecircumscribed circle CC-T.

In another embodiment, through holes TH-S2 each having a quadrangularshape may be defined through the heat radiating member 200-S2, as shownin FIGS. 5C and 5D. The through holes TH-S2 may be arranged spaced apartfrom each other at a pitch (e.g., a predetermined pitch) PT-B in thefirst direction DR1. In an embodiment, the through holes TH-S2 arespaced apart from each other at the same pitch PT-B in the firstdirection DR1.

The through holes TH-S2 include a plurality of first through holes TH1-Sarranged in a second area AR2 and a plurality of second through holesTH2-S arranged in a first area AR1. In an embodiment, the first throughholes TH1-S and the second through holes TH2-S may have the same shapeas a representative example. However, embodiments of the presentdisclosure are not limited thereto.

The first through hole TH1-S may have the quadrangular shape having fourvertices making contact with a circumscribed circle (e.g., apredetermined circumscribed circle) CC-S. In the present exemplaryembodiment, a center S-0 of the circumscribed circle CC-S may correspondto a center of the first through hole TH1-S. Accordingly, the pitch PT-Bcorresponds to a distance in the first direction DR1 between the centerS-0 of the circumscribed circle CC-S and a center of a circumscribedcircle around another first through hole TH1-S adjacent to thecircumscribed circle CC-S. In an embodiment, a diameter DD-S of thefirst through hole TH1-S may correspond to the diameter of thecircumscribed circle CC-S.

The shape of the through holes may be associated with cross-sectionalareas of the through holes when viewed in a plan view. FIGS. 6A to 6Cshow the temperature distributions of display devices respectivelyhaving circular, triangular, and quadrangular shapes with respect to thesame circumscribed circle.

FIGS. 6A to 6C show the temperature measured at a driving circuit builtin the display device as a peak temperature in a right temperaturegraph. In FIGS. 6A to 6C, an area having the highest temperaturesubstantially overlaps an area in which the driving circuit ispositioned.

The temperature of the driving circuit of the display device shown inFIG. 6A was measured at about 43.18 degrees. In this case, as shown inFIG. 6A, the highest temperature measured at the window member of thedisplay device in which the circular-shaped through holes are definedwas about 39.50.

The temperature of the driving circuit of the display device shown inFIG. 6B was measured at about 42.91 degrees. In this case, as shown inFIG. 6B, the highest temperature measured at the window member of thedisplay device in which the triangular-shaped through holes are definedwas about 39.30.

The temperature of the driving circuit of the display device shown inFIG. 6C was measured at about 43.17 degrees. In this case, as shown inFIG. 6C, the highest temperature measured at the window member of thedisplay device in which the quadrangular-shaped through holes aredefined was about 39.49.

When the circumscribed circle is constant, the area of the through holeincreases in an order of the triangular shape, the quadrangular shape,and the circular shape. On the contrary, when the circumscribed circleis constant, the heat discharging area decreases in an order of thetriangular shape, the quadrangular shape, and the circular shape of thethrough hole.

That is, the heat radiating member 200-C having the circular-shapedthrough hole has the smallest heat discharging area, and the heatradiating member 200-S1 having the triangular-shaped through hole hasthe largest heat discharging area. Accordingly, the peak temperaturemeasured at the display device shown in FIG. 6B is the lowesttemperature.

However, a peak temperature difference is equal to or smaller than about1 degree, i.e., about 0.2 degrees. Accordingly, influences on the heatdischarging characteristics by the cross-sectional area difference ofthe through hole may be smaller than influences on the adhesivecharacteristics by the cross-sectional area difference of the throughhole. Therefore, the shape and area of the through holes of the displaydevice according to the present disclosure may be designed in variousways, and thus the adhesive characteristics may be easily controlledwhile ensuring the heat discharging characteristics.

FIG. 7A is an exploded perspective view showing a display deviceaccording to another exemplary embodiment of the present disclosure.FIG. 7B is a cross-sectional view showing a portion of the displaydevice shown in FIG. 7A. FIGS. 8A to 8C are plan views showing heatradiating members according to exemplary embodiments of the presentdisclosure.

For the convenience of explanation, FIG. 7B shows the cross-sectionalview of the display device in an assembled state, that is,cross-sectional views taken along lines III-III′ and IV-IV′ shown inFIG. 7A. In FIGS. 8A to 8C, areas overlapping an inner heat generatingmember 300-I and an additional heat generating member 300-A arerepresented by dashed lines.

Herein, a display device DM-1 according to an exemplary embodiment ofthe present disclosure will be described in further detail withreference to FIGS. 7A to 8C. In FIGS. 7A to 8C, the same referencenumerals denote the same elements in FIGS. 1A to 6C, and thus furtherdetailed descriptions of the same elements may be omitted.

Referring to FIGS. 7A and 7B, the display device DM-1 may include adisplay panel 100, a heat radiating member 200-1, the inner heatgenerating member 300-I, and the additional heat generating member300-A. The inner heat generating member 300-I may be a driving circuitmounted on the display panel 100 and may correspond to the heatgenerating member 300 shown in FIG. 1A. Accordingly, further details ofthe inner heat generating member 300-I will not be repeated.

The additional heat generating member 300-A is disposed outside thedisplay panel 100. The additional heat generating member 300-A may be acircuit board including driving devices, e.g., a processor chip, or apower supply member supplying a power to the display device DM-1.However, according to another embodiment, the additional heat generatingmember 300-A may be provided separate from the display panel and mayinclude various members generating the heat while operating.

The additional heat generating member 300-A may be disposed under theheat radiating member 200-1. Accordingly, the additional heat generatingmember 300-A may be disposed spaced apart from the display panel 100 inthe third direction DR3 such that the heat radiating member 200-1 isdisposed between the additional generating member 300-A and the displaypanel 100.

The heat radiating member 200-1 is disposed between the display panel100 and the additional heat generating member 300-A. Referring to FIGS.7B and 8A, the heat radiating member 200-1 may be divided into aplurality of areas when viewed in a plan view. The areas may include afirst area AR1 overlapping the inner heat generating member 300-I, asecond area AR2 adjacent to the first area AR1, and a third area AR3overlapping the additional heat generating member 300-A.

The heat radiating member 200-1 discharges the heat generated by theheat generating member disposed adjacent thereto. Accordingly, the heatradiating member 200-1 may discharge the heat generated from the displaypanel 100 and the inner heat generating member 300-I in the first areaAR1, discharge the heat generated from the display panel 100 in thesecond area AR2, and discharge the heat generated from the display panel100 and the additional heat generating member 300-A in the third areaAR3.

Through holes TH-1 may be arranged in at least one area of the first,second, and third areas AR1, AR2, and AR3. For instance, as shown inFIG. 8A, the through holes TH-1 of the heat radiating member 200-1 mayinclude first through holes TH1 arranged in the second area AR2. Thesecond area AR2 may be an area generating a relatively low heat. Thus,the display device DM-1 may effectively secure the heat discharging areain the area generating a relatively high heat and secure the adhesivearea in the area generating the relatively low heat.

In another embodiment, as shown in FIG. 8B, through holes TH-1A of aheat radiating member 200-1A may include first through holes TH1 definedin the second area AR2 and third through holes TH3 defined in the thirdarea AR3.

In another embodiment, as shown in FIG. 8C, through holes TH-1B of aheat radiating member 200-1B may include first through holes TH1 definedin the second area AR2, third through holes TH3 defined in the thirdarea AR3, and second through holes TH2 defined in the first area AR1.

The display device DM-1 according to the present exemplary embodimentmay include any of the heat radiating members through which the throughholes are defined in various different arrangements. The through holesmay be arranged and distributed in various ways in accordance with theheat generated by the heat generating member adjacent to the throughhole and are not limited to a specific embodiment.

Referring to FIGS. 7A and 7B again, a first adhesive layer 220 and asecond adhesive layer 230 may be connected to each other through thethrough holes TH-1. A contact area CA, in which the first and secondadhesive layers 220 and 230 make contact with each other, may be definedin the first and second adhesive layers 220 and 230. The contact area CAis defined in the through holes TH-1. Further descriptions about thecontact area CA will not be repeated.

The display device DM-1 according to the present exemplary embodimentincludes the heat radiating member 200-1, and thus the heat radiatingmember 200-1 may be stably coupled to the display panel 100 withoutdeteriorating the adhesive characteristics even though the heatgenerating members are disposed adjacent to opposite surfaces of theheat radiating member 200-1. In addition, although the heat generatingmembers are disposed adjacent to the heat radiating member 200-1, theheat radiating member 200-1 may concurrently or simultaneously securethe adhesive characteristics and the heat discharging characteristics byappropriately designing the through holes.

FIG. 9A is an exploded perspective view showing a display device DM-2according to another exemplary embodiment of the present disclosure.FIG. 9B is a combined perspective view showing the display device DM-2shown in FIG. 9A. FIG. 9C is a cross-sectional view showing a portion ofthe display device DM-2 shown in FIG. 9B. FIGS. 10A to 10C are planviews showing heat radiating members according to exemplary embodimentsof the present disclosure.

For the convenience of explanation, FIG. 9B shows some components as theperspective view, and FIG. 9C shows cross-sectional views respectivelytaken along lines V-V′ and VI-VI′ shown in FIG. 9B. Herein, the displaydevice DM-2 will be described in further detail with reference to FIGS.9A to 9C. In FIGS. 9A to 9C, the same reference numerals denote the sameelements in FIGS. 1A to 8C, and thus further detailed descriptions ofthe same elements will not be repeated.

The display device DM-2 may include a display panel 100, a heatradiating member 200-2, and a heat generating member 300-1. In thepresent exemplary embodiment, the heat radiating member 300-1 isreferred to as a circuit board 300-1 connected to the display panel 100.

The circuit board 300-1 may include at least one driving device thatoutputs an electrical signal to the display panel 100 or processes theelectrical signal provided from the display panel 100. The drivingdevice may generate a heat (e.g., a predetermined heat) while operating.Accordingly, the circuit board 300-1 may be one of heat generatingmembers generating the heat while operating.

The circuit board 300-1 may be physically and electrically connected tothe display panel 100 via at least one flexible film CF. The flexiblefilm CF may include a flexible material. The flexible film CF may bebent, and thus the circuit board 300-1 may be positioned at any ofvarious positions. In the present exemplary embodiment, the flexiblefilm CF may be bent to allow the circuit board CF to be disposed underthe display panel 100 and the heat radiating member 200-2.

Although not shown in the figures, the flexible film CF may be removedfrom the display device DM-2. In this case, the circuit board 300-1 maybe disposed under the display panel 100 after being directly connectedto the display panel 100. The circuit board 300-1 according to thepresent exemplary embodiment may be coupled to the display panel 100 invarious ways.

The circuit board 300-1 may include a driving device 310 and a substrate320. The driving device 310 outputs the electrical signal to drive thedisplay panel 100. The driving device 310 may be provided in a single orplural number and mounted on the substrate 320. The driving device 310may generate a heat (e.g., a predetermined heat) while generating andprocessing the electrical signal.

The substrate 320 may include conductive lines (not shown). Theconductive lines are connected to the driving device 310 to transmit theelectrical signal output from the driving device 310 or the electricalsignal provided from the display panel 100.

In the present exemplary embodiment, the heat radiating member 200-2 mayinclude a first area AR1 overlapping the circuit board 300-1 and asecond area AR2 disposed adjacent to the first area AR1 when viewed in aplan view. The first area AR1 overlapping the circuit board 300-1 may berelatively more largely influenced by the heat generated from thecircuit board 300-1 than the second area AR2.

The first area AR1 may include a first sub-area AR11 overlapping thedriving device 310 and a second sub-area AR12 disposed adjacent to thefirst sub-area AR11. The first sub-area AR11 may be relatively morelargely influenced by the heat generated from the driving device 310than the second sub-area AR12.

Through holes TH-2 may have any of various shapes and may be arranged invarious ways. For the convenience of explanation, FIGS. 10A to 10C showthe driving device 310 and the circuit board 320 as dashed lines.

In an embodiment, referring to FIG. 10A, a plurality of through holesTH-2A of a heat radiating member 200-2A may include first through holesTH1 arranged in the second area AR2 and second through holes TH21arranged in the second sub-area AR12. The through holes TH-2A are mainlyarranged in the area generating the relatively low heat, and thus theheat discharging area of the heat radiating member 200-2A may besecured, and the adhesive area of the heat radiating member 200-2A maybe increased.

In another embodiment, referring to FIG. 10B, a plurality of throughholes TH-2B of a heat radiating member 200-2B may include the firstthrough holes TH1 arranged in the second area AR2, the second throughholes TH21 arranged in the second sub-area AR12, and third through holesTH22 arranged in the first sub-area AR11.

As described above, the deterioration degree of the heat dischargingcharacteristics by the through holes may be relatively smaller than theimproved degree of the adhesive characteristics by the through holes.The heat radiating member 200-2B according to the present exemplaryembodiment includes the third through holes TH22 defined through thefirst sub-area AR11 generating the relatively high heat, and thus theadhesive characteristics of the heat radiating member 200-2B may beimproved.

In another embodiment, referring to FIG. 10C, a plurality of throughholes TH-2C of a heat radiating member 200-2C may have various sizes andmay be arranged in various ways. First through holes TH1 are arranged ata first pitch PT1 in the first direction DR1, and each first throughhole TH1 may have a circular shape having a first diameter DD1.

Second through holes TH21 are arranged at a second pitch PT2 in thefirst direction DR1, and each second through hole TH21 may have acircular shape having a second diameter DD2. Third through holes TH22are arranged at a third pitch PT3 in the first direction DR1, and eachthird through hole TH22 may have a circular shape having a thirddiameter DD3.

In an embodiment, the first, second, and third diameters DD1, DD2, andDD3 may have various sizes and may be designed independently from eachother. In the present exemplary embodiment, the third diameter DD3 maybe smaller than the first and second diameters DD1 and DD2. That is, thethird through holes TH22 may have a cross-sectional area smaller thanthat of the first and second through holes TH1 and TH21.

Accordingly, the heat radiating member 200-2C may have a relativelysmall adhesive area in the first sub-area AR11. The heat radiatingmember 200-2C according to the present exemplary embodiment may improvethe heat discharging characteristics in the area generating therelatively high heat and reduce the adhesive characteristics, such as toa minimum level, and thus the heat discharging characteristics and theadhesive characteristics may be easily independently designed from eachother.

In an embodiment, the first pitch PT1 in the first direction DR1 betweenthe first through holes TH1, the second pitch PT2 in the first directionDR1 between the second through holes TH21, and the third pitch PT3 inthe first direction DR1 between the third through holes TH22 may beindependently designed from each other. In the present exemplaryembodiment, the first, second, and third pitches PT1, PT2, and PT3 maybe the same as one another, but, in another embodiment, the first,second, and third pitches PT1, PT2, and PT3 may be partially the same aseach other or different from one another.

FIG. 11A is an exploded perspective view showing a display device DM-3according to another exemplary embodiment of the present disclosure.FIG. 11B is a cross-sectional view showing a portion of the displaydevice DM-3 shown in FIG. 11A. FIG. 11B shows the cross-sectional viewtaken along a line VII-VII′ shown in FIG. 11A. Herein, the displaydevice DM-3 will be described in further detail with reference to FIGS.11A and 11B. In FIGS. 11A and 11B, the same reference numerals denotethe same elements in FIGS. 1A to 10C, and thus further descriptions ofthe same elements may not be repeated.

Referring to FIG. 11A, the display device DM-3 includes a display panel100, a heat radiating member 200, a protective member 400, and a framemember 500. Although not shown in figures, the display device DM-3 mayfurther include a driving circuit as a heat generating member.

The heat radiating member 200 may have an area equal to or smaller thanan area of the display panel 100 when viewed in a plan view.Accordingly, an outer line EG of the heat radiating member 200 mayoverlap the display panel 100.

The protective member 400 may be disposed under the heat radiatingmember 200. The protective member 400 may include a protective substrate410 and an adhesive member 420.

The protective substrate 410 may be, but is not limited to, aninsulating substrate. The protective substrate 410 may protect a lowerportion of the display panel 100 from external impacts.

The adhesive member 420 fixes the protective substrate 410 to the lowerportion of the display panel 100. The adhesive member 420 may have athickness greater than that of a second adhesive layer. In the presentexemplary embodiment, the adhesive member 420 may directly make contactwith the second adhesive layer 230.

In this case, the display panel 100 and the heat radiating member 200may have improved adhesive force in an area in which the through holesTH overlap the display panel 100 and the heat radiating member 200 bythe coupling of the first adhesive layer 220, the second adhesive layer230, and the adhesive member 420. Accordingly, the heat radiating member200 and the protective member 400 may be stably coupled to the displaypanel 100.

The frame member 500 is disposed between the display panel 100 and theprotective member 400. The frame member 500 has a shape surrounding theheat radiating member 200 when viewed in a plan view.

The outer line EG of the heat radiating member 200 is covered by theframe member 500, and thus the outer line EG is not exposed to theoutside of the display device DM-3. Accordingly, the first adhesivelayer 220 and the second adhesive layer 230 may be prevented orsubstantially prevented from being exposed to the outside, and thus theadhesive force of the first and second adhesive layers 220 and 230 maybe prevented or substantially prevented from being deteriorated. Inaddition, the heat radiating layer 210 may be prevented or substantiallyprevented from being separated from the outer line EG of the heatradiating member 200, and the first adhesive layer 220 may be preventedor substantially prevented from being separated from the display panel100.

In addition, the frame member 500 is disposed spaced apart from theouter line EG of the heat radiating member 200 by a distance (e.g., apredetermined distance) when viewed in a cross section. Accordingly,external impacts applied to an edge of the display device DM-3 may beprevented or substantially prevented from being transmitted to the heatradiating member 200. Thus, the display device DM-3 further includingthe frame member 500 may have improved reliability.

FIG. 12A is a cross-sectional view showing a portion of a display deviceaccording to an exemplary embodiment of the present disclosure. FIG. 12Bis a cross-sectional view showing a portion of a display deviceaccording to another exemplary embodiment of the present disclosure.FIG. 12C is a cross-sectional view showing a portion of a display deviceaccording to another exemplary embodiment of the present disclosure. Forthe convenience of explanation, FIGS. 12A to 12C show a portion of thedisplay device in an area corresponding to the area shown in FIG. 11B.Herein, the display device according to the present exemplaryembodiments will be described in further detail with reference to FIGS.12A to 12C.

Referring to FIG. 12A, the display device may further include anintermediate member 600. The intermediate member 600 may have a stackingstructure of a first member 610 and a second member 620.

In the present exemplary embodiment, the intermediate member 600 may bea shock relief member. For instance, the first member 610 may be acoupling member, and the second member 620 may be an elastic member. Thefirst member 610 may stably fix the second member 620 to the displaypanel 100. The intermediate member 600 may absorb external impactsapplied to the display device to prevent or substantially prevent theexternal impacts from being transmitted to the display panel 100.

In another embodiment, as shown in FIG. 12B, the display device mayfurther include a heat radiating member 200-4 further including anadditional functional layer. The additional functional layer may bedisposed on a surface of at least one of a first adhesive layer 221 anda second adhesive layer 231.

In the present exemplary embodiment, the additional functional layer mayinclude an upper functional layer 222 and a lower functional layer 232.A heat radiating layer 210, the first adhesive layer 221, and the secondadhesive layer 231 may respectively correspond to the heat radiatinglayer 210, the first adhesive layer 220, and the second adhesive layer230 described above.

The additional functional layer may improve or complementcharacteristics of the display device. For instance, the additionalfunctional layer may be a metal layer. As an example, the metal layermay include copper. In this case, the additional functional layer may bea heat radiating layer to improve the heat discharging characteristicsof a heat radiating member 200-4 or an electrostatic discharging layerto prevent or substantially prevent a static electricity from beinggenerated while the display device is operated or assembled.

In another embodiment, the additional functional layer may be aninsulating layer. As an example, the insulating layer may includepolyimide (P1) or polyethylene terephthalate (PET). In this case, theadditional functional layer may serve as a supporter to maintain a shapeof the display panel 100 or a reliability enhancement layer to improveimpact strength of the display device.

In the present exemplary embodiment, the upper functional layer 222 andthe lower functional layer 232 may be independent from each other. Infurther detail, the upper functional layer 222 and the lower functionallayer 232 may be the same functional layer or different functionallayers.

For instance, the upper functional layer 222 and the lower functionallayer 232 may be metal layers. Accordingly, the heat radiating member200-4 may have an improved heat discharging function. In an embodiment,the electrostatic discharging layer may be omitted in the displaydevice, and thus a manufacturing process of the display device may besimplified, and a manufacturing cost of the display device may bereduced.

In another embodiment, one layer of the upper functional layer 222 andthe lower functional layer 232 may be the metal layer, and the otherlayer of the upper functional layer 222 and the lower functional layer232 may be the insulating layer. Accordingly, the display deviceincluding the heat radiating member 200-4 may have electrostaticdischarging characteristics, improved heat discharging characteristics,and improved reliability.

The upper functional layer 222 is disposed between the first adhesivelayer 221 and the display panel 100. The upper functional layer 222makes contact with one surface of the first adhesive layer 221.

In an embodiment, the heat radiating member 200-4 may further include athird adhesive layer 223. The third adhesive layer 223 makes contactwith one surface of the upper functional layer 222. The third adhesivelayer 223 couples the upper functional layer 222 and the intermediatemember 600. However, according to another embodiment, in a case that theintermediate member 600 is omitted, the third adhesive layer 223 maycouple the display panel 100 and the upper functional layer 222.

The lower functional layer 232 makes contact with one surface of thesecond adhesive layer 231. Although not shown in figures, an additionaladhesive layer may be further provided to couple the lower functionallayer 232 and the protective member 400. In an embodiment, at least oneof the upper function layer 222, the lower functional layer 232, and thethird adhesive layer 223 may be omitted.

Referring to FIG. 12C, a display device may include a heat radiatingmember 200-5 further including a third adhesive layer 250. The heatradiating member 200-5 includes a plurality of through holes TH-3defined therethrough. In this case, the through holes TH-3 may penetratethrough a second adhesive layer 230-2 and a heat radiating layer 210.

The third adhesive layer 250 may be disposed between the second adhesivelayer 230-2 and the protective member 400. The third adhesive layer 250may have an adhesive property (e.g., a predetermined adhesive property).In the present exemplary embodiment, the third adhesive layer 250 maydirectly make contact with the second adhesive layer 230-2.

The third adhesive layer 250 may include a flat part 250-H and aprotrusion part 250-L protruded from the flat part 250-H. The protrusionpart 250-L has an integral shape with the flat part 250-H and protrudesinto the through holes TH-3.

In an embodiment, the protrusion part 250-L may make contact with afirst adhesive layer 220-2 through the through holes TH-3. Accordingly,a contact area CA-1 may be defined between the third adhesive layer 250and the first adhesive layer 220-2. The contact area CA-1 has an areaequal to or smaller than that of the through holes TH-3 when viewed in aplan view. Since each of the protrusion part 250-L and the firstadhesive layer 220-2 has an adhesive force, the third adhesive layer 250and the first adhesive layer 220-2 may be physically coupled to eachother through the through holes TH-3 in the contact area CA-1.

In an embodiment, the third adhesive layer 250 may be disposed betweenthe frame member 500 and the protective member 400. The flat part 250-Hof the third adhesive layer 250 extends outward from an edge of the heatradiating layer 210 when viewed in a plan view to overlap with the framemember 500. Accordingly, an additional coupling member may not be neededfor the coupling between the frame member 500 and the protective member400. However, according to another embodiment, the frame member 500 andthe protective member 400 may be coupled to each other by a separatelyprovided coupling member.

The heat radiating layer 210 may be stably coupled to the protectivesubstrate 410 by the first adhesive layer 220-2, the second adhesivelayer 230-2, and the third adhesive layer 250. Thus, coupling stabilitybetween the protective member 400 and the heat radiating member 200-5may be improved.

Although some exemplary embodiments of the present invention have beendescribed, it is to be understood that the present invention should notbe limited to these exemplary embodiments but, rather, various changesand modifications may be made by one of ordinary skill in the art withinthe spirit and scope of the present invention as claimed herein.

What is claimed is:
 1. A display device comprising: a display panel todisplay an image; a heat radiating member at a side portion of thedisplay panel and comprising a first adhesive layer, a second adhesivelayer, and a heat radiating layer between the first adhesive layer andthe second adhesive layer; and a heat generating member overlapping thedisplay panel and the heat radiating member when viewed in a plan view,wherein the heat radiating member includes a first area overlapping theheat generating member and a second area adjacent to the first area whenviewed in a plan view, the first adhesive layer and the second adhesivelayer are connected to each other through a plurality of through holesdefined through the heat radiating layer, and the plurality of throughholes comprises a through hole in the second area.
 2. The display deviceof claim 1, wherein the heat generating member comprises a drivingdevice mounted on the display panel to apply an electrical signal to thedisplay panel.
 3. The display device of claim 1, wherein the heatgenerating member comprises a circuit board comprising a substrateconnected to the display panel and a driving device mounted on thesubstrate to apply an electrical signal to the display panel, and theheat radiating member is arranged between the circuit board and thedisplay panel.
 4. The display device of claim 1, wherein the heatgenerating member comprises a power supply member arranged under theheat radiating member to supply a power to the display panel.
 5. Thedisplay device of claim 1, wherein each of the through holes has acircular shape, an oval shape, a polygonal shape, a closed loop shape,or a combination thereof when viewed in a plan view.
 6. The displaydevice of claim 5, wherein each of the through holes has a diameterequal to or greater than about 2.4 mm, the diameter corresponding to adiameter of a circumscribed circle of the through hole.
 7. The displaydevice of claim 6, wherein a distance between two adjacent through holesamong the plurality of through holes is equal to or greater than about 4mm.
 8. The display device of claim 1, wherein the plurality of throughholes comprises a first through hole defined in the first area and asecond through hole defined in the second area.
 9. The display device ofclaim 8, wherein the first through hole has a cross-sectional area equalto or smaller than a cross-sectional area of the second through hole.10. The display device of claim 8, wherein each of the first throughhole and the second through hole is provided in a plural number, and aratio of areas of the first through holes to the first area is smallerthan a ratio of areas of the second through holes to the second area.11. The display device of claim 1, wherein the through holes arearranged along an edge of the heat radiating layer.
 12. The displaydevice of claim 1, wherein at least one of the first adhesive layer andthe second adhesive layer comprises a double-sided adhesive tape. 13.The display device of claim 1, wherein the heat radiating member furthercomprises a metal layer on a surface of at least one of the firstadhesive layer and the second adhesive layer.
 14. The display device ofclaim 13, wherein the metal layer comprises copper.
 15. The displaydevice of claim 1, wherein the heat radiating member further comprisesan insulating layer on a surface of at least one of the first adhesivelayer and the second adhesive layer.
 16. The display device of claim 15,wherein the insulating layer comprises at least one of polyimide andpolyethylene terephthalate.
 17. The display device of claim 1, furthercomprising a third adhesive layer between the second adhesive layer andthe heat radiating layer, wherein the third adhesive layer is penetratedby the through holes, and the second adhesive layer is connected to thefirst adhesive layer through the through holes.
 18. The display deviceof claim 1, further comprising a frame member surrounding an edge of theheat radiating member, wherein the display panel entirely covers theheat radiating member and the frame member.
 19. The display device ofclaim 18, wherein the frame member is spaced apart from an outer line ofthe heat radiating member when viewed in a cross section.
 20. Thedisplay device of claim 18, further comprising a shock relief memberbetween the display panel and the heat radiating member, wherein theshock relief member entirely covers the heat radiating member and theframe member when viewed in a plan view.
 21. The display device of claim1, wherein the second adhesive layer further comprises a plurality ofconcave portions respectively overlapping the through holes.
 22. Thedisplay device of claim 1, wherein some of the through holes comprise aspace surrounded by the first adhesive layer, the second adhesive layer,and the heat radiating layer.